ELECTRON MICROSCOPY OF NANOPARTICLES FOR LEAD-FREE SOLDERING PREPARED BY WET CHEMICAL SYNTHESIS

Logo poskytovatele

Varování

Publikace nespadá pod Pedagogickou fakultu, ale pod Přírodovědeckou fakultu. Oficiální stránka publikace je na webu muni.cz.
Autoři

BURSIK Jiri ŠKODA David VYKOUKAL Vít SOPOUŠEK Jiří

Rok publikování 2011
Druh Článek ve sborníku
Konference NANOCON 2011
Fakulta / Pracoviště MU

Přírodovědecká fakulta

Citace
www http://nanocon2014.tanger.cz/files/proceedings/nanocon_11/lists/papers/1114.pdf
Klíčová slova solder; nanopowder; electron microscopy
Popis The nanoparticles of pure metals and alloys exhibit the depression of the melting point compared to bulk material, hence they are able to aggregate and to form firm interlayer joints at low temperatures. Exploiting this effect in soldering industry can save energy, work and materials. Using emulsions with nanopowders might be the solution of demanding task of replacing classical Sn-Pb solders by their lead-free substitutes. In this work, Ag- and Sn-based nanopowders were prepared as potential low-toxic constituents of novel solders by a chemical wet synthesis from chemicals of high purity. Various ways of preparation and further storage of the product were examined. Resulting nanoparticles (their size distribution, morphology and tendency for clustering) were characterized by means of scanning and transmission electron microscopy.
Související projekty:

Používáte starou verzi internetového prohlížeče. Doporučujeme aktualizovat Váš prohlížeč na nejnovější verzi.