On the stability of Ag, Cu, and Sn nanoparticles
| Autoři | |
|---|---|
| Rok publikování | 2009 |
| Druh | Konferenční abstrakty |
| Fakulta / Pracoviště MU | |
| Citace | |
| Popis | Metal nanoparticles are considered as potential candidates for use as solder materials for high temperature applications. It is known that physical, electronic, and thermodynamic properties of nano-objects are significantly different from those of the bulk materials because of the effect of decrease of melting point of small particles below the melting point of the bulk material. Exploiting this effect, the substantial depression of melting temperature of lead-free solders could be reached, sparing energy, expenses, being friendly to the environment at the same time. One the other hand the main problem of lead-free solder materials is surface oxidation or reactions which decrease for example the wettability of the solder. As the volume ratio of the metal in oxide layer increases with decreasing particle radius the materials have to be protected. In order to get new information in this field, stability of Ag, Cu and Sn nanopoparticles and surface effects as well as potential application for soldering technology were studied. DSC measurements by means of STA 409 CD/3/5/G apparatus from Netzsch, X-ray diffraction analysis on PANalytical X Pert PRO MPD device equipped with X Celerator detector and transmission electron microscopy (TEM) in a Philips CM12 STEM apparatus were basic methods used for experimental investigations. Experimental results were confronted with theoretical calculations based on the CALPHAD approach. |
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