Nano-modification of Si-wafer surfaces using low-cost ambient air diffuse plasma
| Authors | |
|---|---|
| Year of publication | 2015 |
| Type | Article in Periodical |
| Magazine / Source | International Journal of Nanomanufacturing |
| MU Faculty or unit | |
| Citation | |
| Web | http://www.inderscience.com/info/inarticle.php?artid=75226 |
| Doi | http://dx.doi.org/10.1504/IJNM.2015.075226 |
| Field | Plasma physics |
| Keywords | nano-modification;silicon wafer;surface treatment;diffuse plasma;DBD |
| Description | In this paper, we demonstrated the cleaning and nano-oxidation of Si-wafer surfaces by atmospheric pressure plasma, generated in ambient air using diffuse coplanar surface barrier discharge. Plasma treatment for one second resulted in a significant reduction of water contact angle. The increase in wettability was observed and explained by chemical changes on the analysed Si-wafer surfaces. These changes were analysed by X-ray photoelectron spectroscopy which showed a considerable decrease in the presence of carbon and a significant increase of oxygen on the analysed surfaces. |
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