Mechanical properties of thin silicon films deposited on glass and plastic substrates studied by depth sensing indentation technique

Investor logo
Investor logo

Warning

This publication doesn't include Faculty of Education. It includes Faculty of Science. Official publication website can be found on muni.cz.
Authors

BURŠÍKOVÁ Vilma SLÁDEK Petr SŤAHEL Pavel BURŠÍK Jiří

Year of publication 2006
Type Article in Periodical
Magazine / Source Journal of Non-Crystalline Solids
MU Faculty or unit

Faculty of Science

Citation
Field Solid matter physics and magnetism
Keywords amorphous semiconductors; silicon; mechanical properties; creep; hardness; intendation; microintendation;ELASTIC-MODULUS; COATED SYSTEMS
Description This work concerns the characterisation of mechanical properties of thin amorphous and microcrystalline silicon films deposited on glass and polyethylene terephthalate substrates. The film/substrate indentation response has been investigated from the near surface up to film/substrate interface using depth sensing indentation technique. The universal hardness, Vickers hardness, elastic modulus, fracture toughness and creep resistance of the studied films have been determined. Particular attention has been paid to the effects of the flexible viscoelastic-plastic substrate on the indentation response of the film/substrate system. (c) 2006 Elsevier B.V. All rights reserved.
Related projects:

You are running an old browser version. We recommend updating your browser to its latest version.