Mechanical properties of thin silicon films deposited on glass and plastic substrates studied by depth sensing indentation technique
| Authors | |
|---|---|
| Year of publication | 2006 |
| Type | Article in Periodical |
| Magazine / Source | Journal of Non-Crystalline Solids |
| MU Faculty or unit | |
| Citation | |
| Field | Solid matter physics and magnetism |
| Keywords | amorphous semiconductors; silicon; mechanical properties; creep; hardness; intendation; microintendation;ELASTIC-MODULUS; COATED SYSTEMS |
| Description | This work concerns the characterisation of mechanical properties of thin amorphous and microcrystalline silicon films deposited on glass and polyethylene terephthalate substrates. The film/substrate indentation response has been investigated from the near surface up to film/substrate interface using depth sensing indentation technique. The universal hardness, Vickers hardness, elastic modulus, fracture toughness and creep resistance of the studied films have been determined. Particular attention has been paid to the effects of the flexible viscoelastic-plastic substrate on the indentation response of the film/substrate system. (c) 2006 Elsevier B.V. All rights reserved. |
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